18,706円 This comprehensive, hands-on review of the most up-to-date techniques in RF and microwave measurement combines microwave circuit theory and metrology, in-depth analysis of advanced modern instrumentation, methods and systems, and practical advice for professional RF and microwave engineers and re...

11,772円 • Diagrams and illustrations are included in colour to make explanations easier to understand • Ideal for students taking City and Guilds 2357 and 2391 as a companion volume to their textbooks • Up-to-date for the 17th Edition IEE Wiring Regulations Get instant access to all the words, phrases an...

23,962円 Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The Latest Silicon-on-Sapphire CMOS Design and Fabrication Techniques Develop high-performance SOS-based mic...

16,241円 Electrical Overstress (EOS) continues to impact semiconductor manufacturing, semiconductor components and systems as technologies scale from micro- to nano-electronics. This bookteaches the fundamentals of electrical overstress and how to minimize and mitigate EOS failures. The text provides a cl...

18,231円 This book provides a single-source reference to routing algorithms for Networks-on-Chip (NoCs), as well as in-depth discussions of advanced solutions applied to current and next generation, many core NoC-based Systems-on-Chip (SoCs). After a basic introduction to the NoC design paradigm and archi...

16,839円 New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as ...

18,612円 Praise for Noise Reduction Techniques IN electronic systems "Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the subject, but has the rare ability to communicate that knowledge to others." ーEE Times Electromagnetic Compatibility Engineering is a complete...

6,076円 Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mo...

12,154円 This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers...

13,369円 This book analyzes energy and reliability as major challenges faced by designers of computing frameworks in the nanometer technology regime. The authors describe the existing solutions to address these challenges and then reveal a new reconfigurable computing platform, which leverages high-densit...

12,154円 With the development of Very-Deep Sub-Micron technologies, process variability is becoming increasingly important and is a very important issue in the design of complex circuits. Process variability is the statistical variation of process parameters, meaning that these parameters do not have alwa...

18,231円 This book describes the state-of-the-art in energy efficient, fault-tolerant embedded systems. It covers the entire product lifecycle of electronic systems design, analysis and testing and includes discussion of both circuit and system-level approaches. Readers will be enabled to meet the conflic...